Microelectronic Fabrication Techniques and Procedures
The Microelectronic Fabrication Techniques and Procedures lab is taught in the spring and fall semesters at the HiDEC fabrication facility. The course consists of roughly 50% lecture and 50% hands-on lab work.
The course is designed to prepare students to use the thin-film equipment and processes available in the High Density Electronic Center’s thin-film cleanroom. The process modules covered include lithography, metal deposition and etching, oxide deposition, growth and etching, dry etching, tantalum anodization, photo-definable spin-on dielectric application and patterning, and nickel/gold electroplating. The related metrology modules include microscope inspection, spectrophotometric measurement of oxide thickness, profilometry, and four-point probe measurements.
Details
- Course Number: ELEG 5243L
- Course Name: Microelectronic Fabrication Techniques and Procedures
- Times Offered: Fall/Spring
- Meeting Location: HiDEC cleanroom (HDEC-101)
- Instructor(s)
Prerequisites
- ELEG 5273 – Electronic Packaging