
The aim of this class is to make familiarize students with process technologies and recent developments regarding microsensors, MEMS, and smart devices. In addition, they are given hands-on experience with the fabrication processes using micro-fabrication tools in the cleanroom.
In the classroom, the first part of the lecture series will consist of the theory, design, and application of various microsensors, MEMS, and smart devices. This is followed by the materials and processes required to make different kinds of MEMS and microdevices. Since most of these technologies have been derived from silicon integrated circuit (IC) technologies, the standard microelectronics technology to produce ultra large-scale integrated circuits and package will be discussed. New techniques that have been developed to make microsensors and microactuators, such as bulk and surface silicon micromachining, will also be discussed. In addition, the emerging technology of microstereolithography, which can be used to form true three-dimensional micromechanical structures, is also included.
During the hands-on-experience in microfabrication and MEMS technologies, the student will learn how to fabricate MEMS/smart sensors on silicon wafers using microfabrication tools in the cleanroom. The fabrication process will include metal thin film e-beam evaporation, dielectric thin film growth using an oxidation tube furnace, electrochemical deposition, and various chemical processes. Finally, the devices will be characterized and evaluated.