Wafer/Substrate Preparation
Wafer/Substrate Dicing
MicroAutomation Model 1100 Dicing Saw
- Microprocessor-controlled, programmable, automatic saw for cutting semiconductor wafers and other hard materials including: Silicon, Ceramics, Glass, etc.
- Closed circuit TV system with split image optics to align the wafers before cutting.
- Wafer/substrate size: up to 6 inches
Wafer / Substrate backgrinding and polishing
Logitech Model PM5
A bench-top, research & development scale lapping and polishing system that utilizes both mechanical and chemical mechanical polishing