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Interconnect

Wire Bonding

Orthodyne Model 20 , Kulicke & Soffa Model 4524

• Aluminum and Gold wire bonding
• Ultrasonic and/or thermo-sonic with wire diameters that range from 0.001” to 0.020”

Flip-chip Bonder

MRSI Model 503 M precision aligner/bonder

Dispensing Station for Solders, Flux, Epoxy

EFD Model 1500XL

• Programmable time range: 0.001 to 99.9 seconds
• Air output from 0 to 50 psi

Rework Station

MTR 3000

• Built in air pump. Temperature and air pressure controlled separately. Closed loop temperature control with sensor feedback. Air pressure indicator for convenient operatioin. LED display shows actual hot air temperature.

AirVac DRS24

• Rework and low volume assembly of virtually any surface mount component including BGA’s, QFP’s, CSP’s, connectors, sockets, PLCC’s and specialty components. Including pickup, removal, beam-splitter vision, and placement using precision force measuring.