Physical Vapor Deposition

Sputtering

Materials available: Titanium, Copper, Tantalum, Aluminum
Substrate compatibility: Wafers (most materials) up to 150mm (6”)
Description: The Varian XM-8 is a DC magnetron sputtering system with four stations, one of which is dedicated to RF-etch. All wafer handling is horizontal, allowing fixtures to be used for accommodation of (theoretically) any size/shape. Operation of the XM-8 is more-or-less completely manual.

Materials available: Titanium, Copper, Tantalum, Aluminum
Substrate compatibility: 125mm silicon, 635 micron-thick ONLY
Description: The Varian 3180 is a DC magnetron sputtering system with four stations, one of which is dedicated to RF-etch. All wafer handling is vertical, which limits the tool to the handling of 125mm, 635 micron-thick silicon wafers only. The 3180 is a menu-driven, fully automatic tool capable of processing wafers at high volume.